Invention Grant
- Patent Title: Lead frame semiconductor device
- Patent Title (中): 引线框半导体器件
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Application No.: US13659557Application Date: 2012-10-24
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Publication No.: US08928136B2Publication Date: 2015-01-06
- Inventor: Shinji Watanabe , Akihisa Eimori
- Applicant: Sony Corporation
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Rader, Fishman & Grauer PLLC
- Priority: JP2011-239444 20111031
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L23/495 ; H01L21/00 ; H01L23/00 ; H01L21/56 ; H01L23/31
Abstract:
A lead frame includes: a chip-mounting region provided on a front surface; a lead region including a plurality of concave and convex sections arranged in an in-plane direction of the chip-mounting region; and a terminal arranged in the concave section. A thickness of the lead region from the front surface is smaller than a thickness of the terminal from the front surface.
Public/Granted literature
- US20130105957A1 LEAD FRAME SEMICONDUCTOR DEVICE Public/Granted day:2013-05-02
Information query
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