Invention Grant
US08928141B2 Method for fabricating two substrates connected by at least one mechanical and electrically conductive connection and structure obtained
有权
用于制造通过至少一个机械和导电连接和所获得的结构连接的两个基板的方法
- Patent Title: Method for fabricating two substrates connected by at least one mechanical and electrically conductive connection and structure obtained
- Patent Title (中): 用于制造通过至少一个机械和导电连接和所获得的结构连接的两个基板的方法
-
Application No.: US13983201Application Date: 2012-01-31
-
Publication No.: US08928141B2Publication Date: 2015-01-06
- Inventor: Jean-Charles Souriau
- Applicant: Jean-Charles Souriau
- Applicant Address: FR Paris
- Assignee: Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Current Assignee: Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Current Assignee Address: FR Paris
- Agency: Oliff PLC
- Priority: FR1100327 20110202
- International Application: PCT/FR2012/000042 WO 20120131
- International Announcement: WO2012/104507 WO 20120809
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L23/00 ; H01L25/065 ; H01L25/00 ; H01L21/56 ; H01L23/498
Abstract:
A first substrate provided with a receiving area made from a first metallic material is supplied. A second substrate provided with an insertion area comprising a base surface and at least two bumps made from a second metallic material is arranged facing the first substrate. The bumps are salient from the base surface. A pressure is applied between the first substrate and the second substrate so as to make the bumps penetrate into the receiving area. The first metallic material reacts with the second metallic material so as to form a continuous layer of an intermetallic compound having a base formed by the first and second metallic materials along the interface between the bumps and the receiving area.
Public/Granted literature
Information query
IPC分类:
