Invention Grant
US08928146B2 Bond pad configurations for controlling semiconductor chip package interactions
有权
用于控制半导体芯片封装相互作用的焊盘配置
- Patent Title: Bond pad configurations for controlling semiconductor chip package interactions
- Patent Title (中): 用于控制半导体芯片封装相互作用的焊盘配置
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Application No.: US14169606Application Date: 2014-01-31
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Publication No.: US08928146B2Publication Date: 2015-01-06
- Inventor: Vivian W. Ryan
- Applicant: GLOBALFOUNDRIES Inc.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES Inc.
- Current Assignee: GLOBALFOUNDRIES Inc.
- Current Assignee Address: KY Grand Cayman
- Agency: Amerson Law Firm, PLLC
- Main IPC: H01L23/52
- IPC: H01L23/52 ; H01L23/48 ; H01L23/485 ; H01L23/00
Abstract:
A semiconductor chip includes at least one integrated circuit device and a bond pad that is electrically connected to the at least one integrated circuit device. The bond pad has an irregular configuration when viewed from above that corresponds to a first area portion that is defined by a first substantially regular geometric shape when viewed from above and a second area portion adjacent to the first area portion. The second area portion is located at a greater distance from a centerline of the semiconductor chip than any part of the first area portion when viewed from above, and two sides of the first area portion are substantially aligned with and substantially flush with two respective sides of the second area portion.
Public/Granted literature
- US20140145330A1 BOND PAD CONFIGURATIONS FOR CONTROLLING SEMICONDUCTOR CHIP PACKAGE INTERACTIONS Public/Granted day:2014-05-29
Information query
IPC分类:
