Invention Grant
US08928158B2 Epoxy resin composition for encapsulating semiconductor device and semiconductor device encapsulated with the same
有权
用于封装半导体器件的环氧树脂组合物和用其封装的半导体器件
- Patent Title: Epoxy resin composition for encapsulating semiconductor device and semiconductor device encapsulated with the same
- Patent Title (中): 用于封装半导体器件的环氧树脂组合物和用其封装的半导体器件
-
Application No.: US13478138Application Date: 2012-05-23
-
Publication No.: US08928158B2Publication Date: 2015-01-06
- Inventor: Seung Han , Ju Mi Kim , Sung Su Park , Eun Jung Lee
- Applicant: Seung Han , Ju Mi Kim , Sung Su Park , Eun Jung Lee
- Applicant Address: KR Gumi-si, Kyeongsangbuk-do
- Assignee: Cheil Industries Inc.
- Current Assignee: Cheil Industries Inc.
- Current Assignee Address: KR Gumi-si, Kyeongsangbuk-do
- Agency: Lee & Morse, P.C.
- Priority: KR10-2011-0048753 20110523
- Main IPC: H01L23/29
- IPC: H01L23/29 ; C08L63/04 ; C08G59/32 ; C09D163/04 ; C09J163/04
Abstract:
An epoxy resin composition for encapsulating a semiconductor device includes a curing agent, a curing accelerator, inorganic fillers, and an epoxy resin, the epoxy resin including a first resin represented by Formula 1: wherein R1 and R2 are each independently hydrogen or a C1 to C4 linear or branched alkyl group, and n is a value from 1 to 9 on average.
Public/Granted literature
Information query
IPC分类:
