Invention Grant
- Patent Title: Methods and systems for automated measurement of electrical bonds
- Patent Title (中): 用于自动测量电气键的方法和系统
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Application No.: US12915642Application Date: 2010-10-29
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Publication No.: US08928339B2Publication Date: 2015-01-06
- Inventor: Jason P. Bommer , Andrew M. Robb , Stephen Lee Fahley
- Applicant: Jason P. Bommer , Andrew M. Robb , Stephen Lee Fahley
- Applicant Address: US IL Chicago
- Assignee: The Boeing Company
- Current Assignee: The Boeing Company
- Current Assignee Address: US IL Chicago
- Agency: Armstrong Teasdale LLP
- Main IPC: G01R27/08
- IPC: G01R27/08 ; G01N27/04 ; G01N27/20

Abstract:
A structure is described that includes a first faying surface, a second faying surface for creating an electrical bond with the first faying surface, and a sensor operatively placed proximate the first faying surface and the second faying surface. The sensor includes a current port for injecting a fixed current through the electrical bond, a voltage port for sensing a voltage across the electrical bond induced by the fixed current, a processing device programmed to determine a resistance of the electrical bond based on the fixed current and sensed voltage, and a wireless interface for transmitting at least one of the sensed voltage and the determined resistance to an external device.
Public/Granted literature
- US20120105086A1 METHODS AND SYSTEMS FOR AUTOMATED MEASUREMENT OF ELECTRICAL BONDS Public/Granted day:2012-05-03
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