Invention Grant
- Patent Title: Solid-state imaging device, method for manufacturing the same, method for driving the same, and electronic apparatus
- Patent Title (中): 固态成像装置,其制造方法,其驱动方法和电子装置
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Application No.: US14067511Application Date: 2013-10-30
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Publication No.: US08928788B2Publication Date: 2015-01-06
- Inventor: Hideo Kanbe
- Applicant: Sony Corporation
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Dentons US LLP
- Priority: JP2009-025346 20090205
- Main IPC: H04N5/335
- IPC: H04N5/335 ; H01L27/148 ; H01L27/146 ; H04N5/353 ; H04N5/361 ; H04N5/3728

Abstract:
An imaging device with (1) a substrate; (2) a substrate voltage supply that applies a first potential to the substrate during a light receiving period and applies a second potential to the substrate during a no-light receiving period; and (3) a plurality of pixels each including (a) a light conversion portion, (b) a storage portion that stores signal charges g from the light conversion portion when the first potential is applied to the substrate, (c) a first layer that is in the substrate and set apart from the storage portion by a predetermined distance and adjusts potential distribution in the substrate so that the signal charges generated in the light receiving portion when the second potential is applied to the substrate are swept to a rear surface side of the substrate, and (d) a vertical transfer portion that transfers a signal based on the signal charges in a vertical direction.
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