Invention Grant
- Patent Title: Heat exchanger door for an electronics rack
- Patent Title (中): 用于电子机架的热交换器门
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Application No.: US13775583Application Date: 2013-02-25
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Publication No.: US08929075B2Publication Date: 2015-01-06
- Inventor: Eric A. Eckberg , Howard V. Mahaney, Jr. , William M. Megarity , Roger R. Schmidt , Tejas Shah , Scott A. Shurson
- Applicant: International Business Machines Corporation
- Applicant Address: SG New Tech Park
- Assignee: Lenovo Enterprise Solutions (Singapore) Pte. Ltd.
- Current Assignee: Lenovo Enterprise Solutions (Singapore) Pte. Ltd.
- Current Assignee Address: SG New Tech Park
- Main IPC: H05K7/20
- IPC: H05K7/20 ; G06F1/20 ; B23P15/26

Abstract:
An air-cooling method is provided which includes providing a heat exchanger door and a catch bracket. The door is hingedly mounted to the air inlet or outlet side of an electronics rack, and includes: a door frame spanning at least a portion of the air inlet or outlet side of the rack, wherein the frame includes an airflow opening which facilitates airflow through the rack; an air-to-coolant heat exchanger supported by the door frame and disposed so that airflow through the airflow opening passes thereacross; and a door latch mechanism to selectively latch the heat exchanger door to the rack. The catch bracket is attached to the rack and sized to extend from the rack into the heat exchanger door through a catch opening, and the door latch mechanism is configured and mounted within the heat exchanger door to physically engage the catch bracket within the heat exchanger door.
Public/Granted literature
- US20130263450A1 HEAT EXCHANGER DOOR FOR AN ELECTRONICS RACK Public/Granted day:2013-10-10
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