Invention Grant
- Patent Title: Heat-dissipation structure and electronic device using the same
- Patent Title (中): 散热结构和使用其的电子器件
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Application No.: US13589733Application Date: 2012-08-20
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Publication No.: US08929076B2Publication Date: 2015-01-06
- Inventor: Ling Zhang , Chang-Hong Liu , Shou-Shan Fan
- Applicant: Ling Zhang , Chang-Hong Liu , Shou-Shan Fan
- Applicant Address: CN Beijing TW New Taipei
- Assignee: Tsinghua University,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Tsinghua University,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Beijing TW New Taipei
- Agency: Novak Druce Connolly Bove + Quigg LLP
- Priority: CN201110432703 20111221
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H01L23/373
Abstract:
A heat-dissipation structure includes a first carbon nanotube layer and a metal mesh layer. The first carbon nanotube layer and the metal mesh layer are stacked on each other. The first carbon nanotube layer includes at least one first carbon nanotube paper. An electronic device applying the heat-dissipation structure is also disclosed.
Public/Granted literature
- US20130163205A1 HEAT-DISSIPATION STRUCTURE AND ELECTRONIC DEVICE USING THE SAME Public/Granted day:2013-06-27
Information query
