Invention Grant
- Patent Title: Memory module and on-die termination setting method thereof
- Patent Title (中): 存储器模块和片上终端设置方法
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Application No.: US13772895Application Date: 2013-02-21
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Publication No.: US08929119B2Publication Date: 2015-01-06
- Inventor: Jaejun Lee , Bo-Ra Kim , Jeonghoon Baek
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Samsung-ru, Yeongtong-gu, Suwon-si, Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Samsung-ru, Yeongtong-gu, Suwon-si, Gyeonggi-do
- Agency: Muir Patent Consulting, PLLC
- Priority: KR10-2012-0018568 20120223
- Main IPC: G11C13/00
- IPC: G11C13/00 ; G11C5/06 ; G11C7/10

Abstract:
A memory system includes a plurality of memory devices on a printed circuit board, each of the memory devices including a plurality of external pads; a plurality of connection terminals formed on the printed circuit board, and electrically connected to respective ones of the external pads; and a plurality of signal lines formed on the printed circuit board to connect the connection terminals with the external pads, each of the signal lines between a corresponding connection terminal and a corresponding external pad and having a length. The plurality of memory devices are arranged at different distances from the plurality of connection terminals, and each signal line that connects a connection terminal to an external pad of a memory device either is connected to or does not connect a stub resistor depending on a length of the line.
Public/Granted literature
- US20130223123A1 MEMORY MODULE AND ON-DIE TERMINATION SETTING METHOD THEREOF Public/Granted day:2013-08-29
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