Invention Grant
US08929499B2 System timing margin improvement of high speed I/O interconnect links by using fine training of phase interpolator
有权
通过使用相位内插器的精细训练,提高了高速I / O互连链路的系统时序裕度
- Patent Title: System timing margin improvement of high speed I/O interconnect links by using fine training of phase interpolator
- Patent Title (中): 通过使用相位内插器的精细训练,提高了高速I / O互连链路的系统时序裕度
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Application No.: US13631874Application Date: 2012-09-29
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Publication No.: US08929499B2Publication Date: 2015-01-06
- Inventor: Fangxing Wei , Subratakumar Mandal
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Caven & Aghevli LLC
- Main IPC: H04L7/00
- IPC: H04L7/00 ; H04L25/00 ; H04L25/40 ; H04B1/16

Abstract:
Methods and apparatus for improving system timing margin of high speed I/O (input/output) interconnect links by using fine training of a phase interpolator are described. In some embodiments, I/O links use forward clock architecture to send data from transmit driver to receiver logic. Moreover, at the receiver side, Phase Interpolator (PI) logic may be used to place the sampling clock at the center of the valid data window or eye. In an embodiment, a Digital Eye Width Monitor (DEWM) logic may be used to measure data eye width in real time. Other embodiments are also disclosed.
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