Invention Grant
- Patent Title: Optoelectronic chips including coupler region and methods of manufacturing the same
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Application No.: US13474809Application Date: 2012-05-18
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Publication No.: US08929691B2Publication Date: 2015-01-06
- Inventor: Seong-ho Cho
- Applicant: Seong-ho Cho
- Applicant Address: KR Gyeonggi-Do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-Do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2011-0113581 20111102
- Main IPC: G02B6/12
- IPC: G02B6/12 ; G02B6/125 ; H01L31/12 ; G02B6/42 ; G02B6/134

Abstract:
An optoelectronic chip including a coupler region, and a method of manufacturing the same, include a substrate; a coupler region formed of a material having a refractive index lower than the substrate and surrounded by the substrate. The coupler region includes a total reflection surface that totally reflects light incident through a surface of the substrate into the substrate or emits light guided in the substrate through the surface of the substrate.
Public/Granted literature
- US08995799B2 Optoelectronic chips including coupler region and methods of manufacturing the same Public/Granted day:2015-03-31
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