Invention Grant
- Patent Title: Electrical bushing for an implantable medical device
- Patent Title (中): 用于可植入医疗器械的电气套管
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Application No.: US12850412Application Date: 2010-08-04
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Publication No.: US08929987B2Publication Date: 2015-01-06
- Inventor: Jens Troetzschel , Heiko Specht
- Applicant: Jens Troetzschel , Heiko Specht
- Applicant Address: DE Hanau
- Assignee: Heraeus Precious Metals GmbH & Co. KG
- Current Assignee: Heraeus Precious Metals GmbH & Co. KG
- Current Assignee Address: DE Hanau
- Agency: Dicke, Billig & Czaja, PLLC
- Priority: DE102009035971 20090804
- Main IPC: A61N1/37
- IPC: A61N1/37 ; A61N1/375

Abstract:
One aspect relates to an electrical bushing for an implantable medical device, having an annulus-like holding element for holding the electrical bushing in the implantable medical device, whereby the holding element includes a through-opening, at least one elongated conducting wire extends through the through-opening, and an insulation element for forming a hermetic seal between the holding element and the conducting wire is arranged in the through-opening. One aspect provides for a cermet-containing bearing element to be arranged between the insulation element and the conducting wire.
Public/Granted literature
- US20110034966A1 ELECTRICAL BUSHING FOR AN IMPLANTABLE MEDICAL DEVICE Public/Granted day:2011-02-10
Information query
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