Invention Grant
- Patent Title: Method of measuring an overlay of an object
- Patent Title (中): 测量物体重叠的方法
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Application No.: US13107166Application Date: 2011-05-13
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Publication No.: US08930011B2Publication Date: 2015-01-06
- Inventor: Jin-Seok Heo , Seok-Hwan Oh , Jeong-Ho Yeo
- Applicant: Jin-Seok Heo , Seok-Hwan Oh , Jeong-Ho Yeo
- Applicant Address: KR Suwon-Si, Gyeonggi-Do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-Si, Gyeonggi-Do
- Agency: F. Chau & Associates, LLC
- Priority: KR10-2010-0060352 20100625
- Main IPC: G06F19/00
- IPC: G06F19/00 ; H01L21/00 ; G06K9/00 ; G03F7/20

Abstract:
A method of measuring an overlay of an object is provided. In the method, first information of a first structure may be obtained. A preliminary structure may be formed on the first structure. Second information of the preliminary structure may be obtained. The first information and the second information may be processed to obtain virtual information of a second structure that would be formed on the first structure if a process is performed on the preliminary structure. A virtual overlay between the first structure and the second structure may be measured using the virtual information.
Public/Granted literature
- US20110320025A1 METHOD OF MEASURING AN OVERLAY OF AN OBJECT Public/Granted day:2011-12-29
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