Invention Grant
US08930174B2 Modeling technique for resistive random access memory (RRAM) cells 有权
电阻随机存取存储器(RRAM)单元的建模技术

  • Patent Title: Modeling technique for resistive random access memory (RRAM) cells
  • Patent Title (中): 电阻随机存取存储器(RRAM)单元的建模技术
  • Application No.: US13077941
    Application Date: 2011-03-31
  • Publication No.: US08930174B2
    Publication Date: 2015-01-06
  • Inventor: Wei Lu
  • Applicant: Wei Lu
  • Applicant Address: US CA Santa Clara
  • Assignee: Crossbar, Inc.
  • Current Assignee: Crossbar, Inc.
  • Current Assignee Address: US CA Santa Clara
  • Agency: Ogawa P.C.
  • Main IPC: G06F17/50
  • IPC: G06F17/50 G06G7/62 G11C13/00
Modeling technique for resistive random access memory (RRAM) cells
Abstract:
Accurate simulation of two-terminal resistive random access memory (RRAM) behavior is accomplished by solving equations including state variables for filament length growth, filament width growth, and temperature. Such simulations are often run in a SPICE environment. Highly accurate models simulate the dynamic nature of filament propagation and multiple resistive states by using a sub-circuit to represent an RRAM cell. In the sub-circuit, voltages on floating nodes control current output while the voltage dropped across the sub-circuit controls growth and temperature characteristics. Properly executed, such a sub-circuit can accurately model filament growth at all phases of conductance including dynamic switching and a plurality of resistive states.
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