Invention Grant
- Patent Title: Semiconductor device predictive dynamic thermal management
- Patent Title (中): 半导体器件预测动态热管理
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Application No.: US13303882Application Date: 2011-11-23
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Publication No.: US08930724B2Publication Date: 2015-01-06
- Inventor: Hwisung Jung
- Applicant: Hwisung Jung
- Applicant Address: US CA Irvine
- Assignee: Broadcom Corporation
- Current Assignee: Broadcom Corporation
- Current Assignee Address: US CA Irvine
- Agency: Sterne, Kessler, Goldstein & Fox PLLC
- Main IPC: G06F1/00
- IPC: G06F1/00 ; G06F1/32 ; H01L23/34 ; G06F1/20

Abstract:
A semiconductor device includes a memory storing a lookup table including stored values associated with modes of operation of a component of the semiconductor device. A monitor monitors an operating parameter of the component in real-time, and reports a calculated value associated with the same. A power manager determines a change in the mode of operation of the component based on a comparison of the calculated value with a corresponding stored value, and adjusts a current mode of operation of the component in real-time.
Public/Granted literature
- US20130046999A1 Semiconductor Device Predictive Dynamic Thermal Management Public/Granted day:2013-02-21
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