Invention Grant
- Patent Title: Electrical connection having press-fitted partners with an OSP coating
- Patent Title (中): 具有压配合的OSP涂层的电气连接
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Application No.: US13502795Application Date: 2010-10-04
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Publication No.: US08932090B2Publication Date: 2015-01-13
- Inventor: Philippe Jaeckle , Stefan Rysy , Michael Krapp , Svetislav Vukovic
- Applicant: Philippe Jaeckle , Stefan Rysy , Michael Krapp , Svetislav Vukovic
- Applicant Address: DE Stuttgart
- Assignee: Robert Bosch GmbH
- Current Assignee: Robert Bosch GmbH
- Current Assignee Address: DE Stuttgart
- Agency: Michael Best & Friedrich LLP
- Priority: DE102009045806 20091019; DE102009047043 20091124
- International Application: PCT/EP2010/064726 WO 20101004
- International Announcement: WO2011/047953 WO 20110428
- Main IPC: H01R9/24
- IPC: H01R9/24 ; H01R4/58 ; H01R4/26
Abstract:
The invention relates to a solderless electrical connection (42) between a first joining partner (10, 46) and a second joining partner (24, 26; 44) for connecting an electrical component, a connector strip or a lead frame. According to the invention, the first joining partner (10, 46) or both joining partners (10, 46, 24, 26, 44) have an OSP coating (56) on their respective contact surfaces (14, 48, 54, 34, 50).
Public/Granted literature
- US20120270432A1 SOLDERLESS ELECTRICAL CONNECTION Public/Granted day:2012-10-25
Information query
