Invention Grant
- Patent Title: Methods for laser cutting glass substrates
- Patent Title (中): 激光切割玻璃基板的方法
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Application No.: US12824609Application Date: 2010-06-28
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Publication No.: US08932510B2Publication Date: 2015-01-13
- Inventor: Xinghua Li , Lisa Anne Moore
- Applicant: Xinghua Li , Lisa Anne Moore
- Applicant Address: US NY Corning
- Assignee: Corning Incorporated
- Current Assignee: Corning Incorporated
- Current Assignee Address: US NY Corning
- Agent John T. Haran
- Main IPC: B23K26/00
- IPC: B23K26/00 ; C03B33/09 ; B23K26/40 ; C03C23/00
Abstract:
A method for cutting a glass article from a strengthened glass substrate having a surface compression layer and a tensile layer includes forming an edge defect in the surface compression layer on a first edge of the strengthened glass substrate. The method further includes propagating a through vent through the surface compression and tensile layers at the edge defect. The through vent precedes a region of separation along a cut line between the glass article and the strengthened glass substrate.
Public/Granted literature
- US20110049765A1 Methods for Laser Cutting Glass Substrates Public/Granted day:2011-03-03
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