Invention Grant
- Patent Title: Polyamide blend molding compound
- Patent Title (中): 聚酰胺共混物模塑料
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Application No.: US12845797Application Date: 2010-07-29
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Publication No.: US08932693B2Publication Date: 2015-01-13
- Inventor: Botho Hoffmann , Ralph Kettl
- Applicant: Botho Hoffmann , Ralph Kettl
- Applicant Address: CH Domat/Ems
- Assignee: EMS-Patent AG
- Current Assignee: EMS-Patent AG
- Current Assignee Address: CH Domat/Ems
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: EP09167002 20090731; EP10165021 20100604
- Main IPC: B32B1/08
- IPC: B32B1/08 ; C08L77/06 ; C08L77/02 ; F16L9/127 ; B32B1/02 ; C08L23/20

Abstract:
Polyamide blend molding compound, includes a polyamide blend content and at least one impact-resistant component, characterized in that the polyamide blend content includes the following polyamides: (A) 20 to 65% by weight of at least one semi-crystalline polyamide with an enthalpy of fusion >40 J/g and with an average of at least 8 C atoms per monomeric unit; (B) 8 to 25% by weight of at least one amorphous and/or microcrystalline polyamide, with the microcrystalline polyamide having an enthalpy of fusion in the range of 4 to 40 J/g, and (C) 1 to 20% by weight of at least one polyamide with an average of a maximum of 6 C atoms per monomeric unit. The impact-resistant component includes as follows: (D) 10 to 40% by weight of a polyamide elastomer which is composed of hard segments and soft segments, with the hard segments being based on lactams and/or amino-carboxylic acids, and (E) 0 to 35% by weight of a non-polyamide elastomer.
Public/Granted literature
- US20110023986A1 POLYAMIDE BLEND MOLDING COMPOUND Public/Granted day:2011-02-03
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