Invention Grant
- Patent Title: Thermosetting resin composition and board using the same
- Patent Title (中): 热固性树脂组合物和使用其的板
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Application No.: US12645967Application Date: 2009-12-23
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Publication No.: US08932705B2Publication Date: 2015-01-13
- Inventor: Chung-Kun Cho , Myung-Sup Jung , Kwang-Hee Kim , Jae-Jun Lee , Kalinina Fedosya , Mahn Jong Kim , Chung Won Park
- Applicant: Chung-Kun Cho , Myung-Sup Jung , Kwang-Hee Kim , Jae-Jun Lee , Kalinina Fedosya , Mahn Jong Kim , Chung Won Park
- Applicant Address: KR
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR
- Agency: Cantor Colburn LLP
- Priority: KR10-2008-0133800 20081224; KR10-2009-0121466 20091208
- Main IPC: B32B3/26
- IPC: B32B3/26 ; B32B15/08 ; C08K7/22 ; C08K7/24 ; C08K7/26 ; H05K1/03 ; C08K7/28 ; C08K5/1515 ; C08K5/3415
Abstract:
Disclosed is a thermosetting resin composition including a thermosetting aromatic oligomer represented by the following Chemical Formula 1, a hollow particle, and solvent, and a board comprising the same. In the above Chemical Formula 1, wherein B, L1, L2, Z1 and Z2 are the same as in defined in the specification.
Public/Granted literature
- US20100159231A1 THERMOSETTING RESIN COMPOSITION AND BOARD USING THE SAME Public/Granted day:2010-06-24
Information query
