Invention Grant
US08932801B2 Photosensitive polyimides 有权
光敏聚酰亚胺

Photosensitive polyimides
Abstract:
The present invention relates to an isocyanate-modified photosensitive polyimide. The photosensitive polyimide of the invention possesses excellent heat resistance, chemistry resistance, and flexibility, and can be used as a liquid photo resist or dry film resist, or used in a solder resist, coverlay film, or printed wiring board.
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