Invention Grant
- Patent Title: Method for manufacturing semiconductor device
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Application No.: US14202670Application Date: 2014-03-10
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Publication No.: US08932914B2Publication Date: 2015-01-13
- Inventor: Shunpei Yamazaki , Takuya Hirohashi , Masahiro Takahashi , Takashi Shimazu
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP Atsugi-shi, Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi-shi, Kanagawa-ken
- Agency: Robinson Intellectual Property Law Office, P.C.
- Agent Eric J. Robinson
- Priority: JP2009-296825 20091228
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/336 ; H01L27/108 ; H01L29/66 ; H01L21/02 ; H01L27/12 ; H01L29/786

Abstract:
A larger substrate can be used, and a transistor having a desirably high field-effect mobility can be manufactured through formation of an oxide semiconductor layer having a high degree of crystallinity, whereby a large-sized display device, a high-performance semiconductor device, or the like can be put into practical use. A first multi-component oxide semiconductor layer is formed over a substrate and a single-component oxide semiconductor layer is formed thereover; then, crystal growth is carried out from a surface to an inside by performing heat treatment at 500° C. to 1000° C. inclusive, preferably 550° C. to 750° C. inclusive so that a first multi-component oxide semiconductor layer including single crystal regions and a single-component oxide semiconductor layer including single crystal regions are formed; and a second multi-component oxide semiconductor layer including single crystal regions is stacked over the single-component oxide semiconductor layer including single crystal regions.
Public/Granted literature
- US09054134B2 Method for manufacturing semiconductor device Public/Granted day:2015-06-09
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