Invention Grant
- Patent Title: Highly scalable trench capacitor
- Patent Title (中): 高度可扩展的沟槽电容
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Application No.: US13803281Application Date: 2013-03-14
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Publication No.: US08932932B2Publication Date: 2015-01-13
- Inventor: Kangguo Cheng , Johnathan E. Faltermeier , Anne Marie Kimball
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Joseph P. Abate; Howard H. Cohn
- Main IPC: H01L29/92
- IPC: H01L29/92 ; H01L21/02 ; H01L49/02 ; H01L27/108 ; H01L29/66 ; H01L21/768

Abstract:
An improved trench structure, and method for its fabrication are disclosed. Embodiments of the present invention provide a trench in which the collar portion has an air gap instead of a solid oxide collar. The air gap provides a lower dielectric constant. Embodiments of the present invention can therefore be used to make higher-performance devices (due to reduced parasitic leakage), or smaller devices, due to the ability to use a thinner collar to achieve the same performance as a thicker collar comprised only of oxide (with no air gap). Alternatively, a design choice can be made to achieve a combination of improved performance and reduced size, depending on the application.
Public/Granted literature
- US20130203234A1 HIGHLY SCALABLE TRENCH CAPACITOR Public/Granted day:2013-08-08
Information query
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