Invention Grant
- Patent Title: Polyamide and polyamide composition
- Patent Title (中): 聚酰胺和聚酰胺组合物
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Application No.: US13702472Application Date: 2011-06-10
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Publication No.: US08933167B2Publication Date: 2015-01-13
- Inventor: Yukiyoshi Sasaki , Hiroshi Oyamada , Yasukazu Shikano
- Applicant: Yukiyoshi Sasaki , Hiroshi Oyamada , Yasukazu Shikano
- Applicant Address: JP Tokyo
- Assignee: Asahi Kasei Chemicals Corporation
- Current Assignee: Asahi Kasei Chemicals Corporation
- Current Assignee Address: JP Tokyo
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JP2010-134472 20100611
- International Application: PCT/JP2011/063345 WO 20110610
- International Announcement: WO2011/155596 WO 20111215
- Main IPC: C08L77/00
- IPC: C08L77/00 ; C08G69/26 ; C08L77/06 ; C08K7/14 ; C08K3/00

Abstract:
A polyamide comprising (a) a unit comprising adipic acid and hexamethylenediamine and (b) a unit comprising isophthalic acid and hexamethylenediamine, wherein a ratio of the isophthalic acid component to the total carboxylic acid component in the polyamide is 0.05≦(x)≦0.5 and a range of blocking ratio (Y) is −0.3≦(Y)≦0.8. Also provided are compositions comprising 30 to 95% by mass of the above polyamide and 5 to 70% by mass of an inorganic filler.
Public/Granted literature
- US20130085229A1 POLYAMIDE AND POLYAMIDE COMPOSITION Public/Granted day:2013-04-04
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