Invention Grant
- Patent Title: Laser processing method for cutting planar object
- Patent Title (中): 用于切割平面物体的激光加工方法
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Application No.: US12443755Application Date: 2007-09-25
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Publication No.: US08933368B2Publication Date: 2015-01-13
- Inventor: Kazuhiro Atsumi , Koji Kuno , Tatsuya Suzuki
- Applicant: Kazuhiro Atsumi , Koji Kuno , Tatsuya Suzuki
- Applicant Address: JP Hamamatsu-shi, Shizuoka
- Assignee: Hamamatsu Photonics K.K.
- Current Assignee: Hamamatsu Photonics K.K.
- Current Assignee Address: JP Hamamatsu-shi, Shizuoka
- Agency: Drinker Biddle & Reath LLP
- Priority: JPP2006-271986 20061003
- International Application: PCT/JP2007/068515 WO 20070925
- International Announcement: WO2008/041539 WO 20080410
- Main IPC: B23K26/00
- IPC: B23K26/00 ; H01L21/78 ; B23K26/40 ; C03B33/02 ; C03B33/09 ; B23K26/04 ; H01L21/02

Abstract:
A modified region is accurately formed at a desirable position with respect to a laser light irradiation surface of an object to be processed. When an average difference γ has a value exceeding a predetermined threshold during trace recording, a particle segment Z including a line segment S where the average difference γ exceeds the predetermined threshold is defined. This determines that a particle exists on a line to cut 5 and randomly reflects measuring laser light, whereby a segment where the presence of the particle affects a control signal in a line segment to cut is detected as the particle segment Z. Correcting the control signal in the particle segment Z inhibits a converging lens from moving more than necessary because of an error included in the signal value under the influence of the presence of the particle, thus allowing the converging point of the processing laser light to accurately follow a front face 3.
Public/Granted literature
- US20100012633A1 LASER PROCESSING METHOD Public/Granted day:2010-01-21
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