Invention Grant
- Patent Title: Pulse laser machining apparatus and pulse laser machining method
- Patent Title (中): 脉冲激光加工设备和脉冲激光加工方法
-
Application No.: US13388508Application Date: 2010-06-24
-
Publication No.: US08933374B2Publication Date: 2015-01-13
- Inventor: Makoto Hayashi
- Applicant: Makoto Hayashi
- Applicant Address: JP Tokyo
- Assignee: Toshiba Kikai Kabushiki Kaisha
- Current Assignee: Toshiba Kikai Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: DLA Piper LLP (US)
- Priority: JP2009-180285 20090803
- International Application: PCT/JP2010/004197 WO 20100624
- International Announcement: WO2011/016176 WO 20110210
- Main IPC: H05B7/18
- IPC: H05B7/18 ; B23K26/00 ; B23K26/14 ; B23K26/16 ; B23K26/06 ; B23K26/02 ; B23K26/10 ; B23K26/08 ; B23K26/03 ; G02B26/10

Abstract:
A pulse laser machining apparatus and method generates a clock signal, emits a pulse laser beam in synchronization with the clock signal, scans the pulse laser beam in synchronization with the clock signal only in a one-dimensional direction, moves a stage in a direction perpendicular to the one-dimensional direction, passes or cuts off the pulse laser beam in synchronization with the clock signal, and controls the passing or cutting off of the pulse laser beam based on the number of light pulses of the pulse laser beam.
Public/Granted literature
- US20120187103A1 PULSE LASER MACHINING APPARATUS AND PULSE LASER MACHINING METHOD Public/Granted day:2012-07-26
Information query