Invention Grant
- Patent Title: Sample analysis apparatus and sample analysis program
- Patent Title (中): 样品分析仪器和样品分析程序
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Application No.: US13829289Application Date: 2013-03-14
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Publication No.: US08933402B2Publication Date: 2015-01-13
- Inventor: Tomoya Shimizu
- Applicant: HORIBA, Ltd.
- Applicant Address: JP Kyoto-shi
- Assignee: HORIBA, Ltd.
- Current Assignee: HORIBA, Ltd.
- Current Assignee Address: JP Kyoto-shi
- Agency: Alleman Hall McCoy Russell & Tuttle LLP
- Priority: JP2012-061152 20120316; JP2013-022676 20130207
- Main IPC: G01N5/00
- IPC: G01N5/00 ; H01L21/66

Abstract:
A sample is analyzed efficiently with combining a structural defect detection and a physical information measurement so as to determine whether a structural defect is the defect that degrades the device performance or not, not only by detecting the structural defect exists in the sample, but also by measuring a physical information that occurs due to the structural defect. It comprises a structural defect detection device 2 that detect a structural defect KK of a sample W, a structural defect setting device that sets up the structural defect KK for which a physical information is to be measured based on the defect information among the structural defect KK detected by the structural defect detection device 2, and a physical information measurement device 3 that measures the physical information of the defect region KR including the structural defect set up by the structural defect setting device.
Public/Granted literature
- US20130240729A1 SAMPLE ANALYSIS APPARATUS AND SAMPLE ANALYSIS PROGRAM Public/Granted day:2013-09-19
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