Invention Grant
- Patent Title: Method and structure for receiving a micro device
- Patent Title (中): 接收微型装置的方法和结构
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Application No.: US13562184Application Date: 2012-07-30
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Publication No.: US08933433B2Publication Date: 2015-01-13
- Inventor: John A. Higginson , Andreas Bibl , Hsin-Hua Hu
- Applicant: John A. Higginson , Andreas Bibl , Hsin-Hua Hu
- Applicant Address: US CA Santa Clara
- Assignee: Luxvue Technology Corporation
- Current Assignee: Luxvue Technology Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L31/00
Abstract:
A method and structure for receiving a micro device on a receiving substrate are disclosed. A micro device such as a micro LED device is punched-through a passivation layer covering a conductive layer on the receiving substrate, and the passivation layer is hardened. In an embodiment the micro LED device is punched-through a B-staged thermoset material. In an embodiment the micro LED device is punched-through a thermoplastic material.
Public/Granted literature
- US20140027709A1 METHOD AND STRUCTURE FOR RECEIVING A MICRO DEVICE Public/Granted day:2014-01-30
Information query
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