Invention Grant
- Patent Title: Wafers and chips comprising test structures
- Patent Title (中): 晶圆和芯片包括测试结构
-
Application No.: US13560897Application Date: 2012-07-27
-
Publication No.: US08933448B2Publication Date: 2015-01-13
- Inventor: Markus Zundel , Uwe Schmalzbauer
- Applicant: Markus Zundel , Uwe Schmalzbauer
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L23/58
- IPC: H01L23/58
Abstract:
Wafers with chips thereon and corresponding chips are provided where test structures or parts thereof are provided in a peripheral chip area of the chip. Corresponding methods are also disclosed.
Public/Granted literature
- US20140027772A1 Wafers and Chips Comprising Test Structures Public/Granted day:2014-01-30
Information query
IPC分类:
