Invention Grant
- Patent Title: High-voltage light-emitting device
- Patent Title (中): 高压发光装置
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Application No.: US13655534Application Date: 2012-10-19
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Publication No.: US08933469B2Publication Date: 2015-01-13
- Inventor: Hui-Ching Feng , Chen-Hong Lee , Wei-Kang Cheng , Shyi-Ming Pan
- Applicant: Formosa Epitaxy Incorporation
- Applicant Address: TW Taoyuan County
- Assignee: Formosa Epitaxy Incorporation
- Current Assignee: Formosa Epitaxy Incorporation
- Current Assignee Address: TW Taoyuan County
- Agency: Rosenberg, Klein & Lee
- Priority: TW100138435A 20111024
- Main IPC: H01L29/18
- IPC: H01L29/18 ; H01L33/00
Abstract:
The present invention relates to a high-voltage light-emitting device suitable for light-emitting diode chip array module. The device comprises a set of light emitting diode chips, about 18˜25 chips, deposited on a substrate by using a non-matrix arrangement. Through the adjustments, the high-voltage light-emitting device of the present invention has optimized luminous efficiency.
Public/Granted literature
- US20130099259A1 HIGH-VOLTAGE LIGHT-EMITTING DEVICE Public/Granted day:2013-04-25
Information query
IPC分类:
