Invention Grant
- Patent Title: Light emitting diode package and manufacturing method thereof
- Patent Title (中): 发光二极管封装及其制造方法
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Application No.: US13564330Application Date: 2012-08-01
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Publication No.: US08933474B2Publication Date: 2015-01-13
- Inventor: Cheol Jun Yoo , Young Hee Song
- Applicant: Cheol Jun Yoo , Young Hee Song
- Applicant Address: KR Suwon-Si, Gyeonggi-Do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-Si, Gyeonggi-Do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2011-0076612 20110801
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L33/60
Abstract:
A light emitting diode (LED) package and a manufacturing method thereof are provided. The LED package includes a substrate including a circuit layer, an LED mounted on the substrate, and a plurality of protruded reflection units disposed in a region excluding an LED mounting region on the substrate and configured to reflect light generated from the LED.
Public/Granted literature
- US20130032843A1 LIGHT EMITTING DIODE PACKAGE AND MANUFACTURING METHOD THEREOF Public/Granted day:2013-02-07
Information query
IPC分类:
