Invention Grant
- Patent Title: Light emitting device
- Patent Title (中): 发光装置
-
Application No.: US13609726Application Date: 2012-09-11
-
Publication No.: US08933475B2Publication Date: 2015-01-13
- Inventor: Katsutoshi Nakagawa , Yasumasa Ooya , Yoshitaka Funayama , Daichi Usui
- Applicant: Katsutoshi Nakagawa , Yasumasa Ooya , Yoshitaka Funayama , Daichi Usui
- Applicant Address: JP Tokyo JP Yokohama-shi
- Assignee: Kabushiki Kaisha Toshiba,Toshiba Materials Co., Ltd.
- Current Assignee: Kabushiki Kaisha Toshiba,Toshiba Materials Co., Ltd.
- Current Assignee Address: JP Tokyo JP Yokohama-shi
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2010-054418 20100311
- Main IPC: H01L33/50
- IPC: H01L33/50 ; H01L33/56 ; H01S5/022 ; H01L33/02 ; H01S5/00

Abstract:
A light emitting device 1 according to an embodiment includes a planar alumina substrate, a semiconductor light-emitting element mounted on the alumina substrate, and a phosphor layer. The phosphor layer includes a silicone resin layer provided to cover an upper surface and a side surface of the semiconductor light-emitting element and a phosphor emitting visible light by being excited with light emitted from the semiconductor light-emitting element. The phosphor is dispersed in the silicone resin layer. The alumina substrate has a water absorption rate of 5% or more and 60% or less, and an adhesion strength between the alumina substrate and the silicone resin layer is 1 N or more.
Public/Granted literature
- US20130240915A1 LIGHT EMITTING DEVICE Public/Granted day:2013-09-19
Information query
IPC分类: