Invention Grant
- Patent Title: Metal/polysilicon gate trench power mosfet
- Patent Title (中): 金属/多晶硅栅沟槽功率MOSFET
-
Application No.: US13545131Application Date: 2012-07-10
-
Publication No.: US08933507B2Publication Date: 2015-01-13
- Inventor: Chun-Wai Ng , Hsueh-Liang Chou , Po-Chih Su , Ruey-Hsin Liu
- Applicant: Chun-Wai Ng , Hsueh-Liang Chou , Po-Chih Su , Ruey-Hsin Liu
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Eschweiler & Associates, LLC
- Main IPC: H01L29/66
- IPC: H01L29/66

Abstract:
The present disclosure relates to a power MOSFET device having a relatively low resistance hybrid gate electrode that enables good switching performance. In some embodiments, the power MOSFET device has a semiconductor body. An epitaxial layer is disposed on the semiconductor body. A hybrid gate electrode, which controls the flow of electrons between a source electrode and a drain electrode, is located within a trench extending into the epitaxial layer. The hybrid gate electrode has an inner region having a low resistance metal, an outer region having a polysilicon material, and a barrier region disposed between the inner region and the outer region. The low resistance of the inner region provides for a low resistance to the hybrid gate electrode that enables good switching performance for the power MOSFET device.
Public/Granted literature
- US20140015037A1 Novel Metal/Polysilicon Gate Trench Power Mosfet Public/Granted day:2014-01-16
Information query
IPC分类: