Invention Grant
- Patent Title: Semiconductor device and method for fabricating the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US13023427Application Date: 2011-02-08
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Publication No.: US08933509B2Publication Date: 2015-01-13
- Inventor: Shin Gyu Choi , Seung Chul Oh
- Applicant: Shin Gyu Choi , Seung Chul Oh
- Applicant Address: KR Icheon-si
- Assignee: SK hynix Inc.
- Current Assignee: SK hynix Inc.
- Current Assignee Address: KR Icheon-si
- Agency: Kilpatrick Townsend & Stockton LLP
- Priority: KR10-2006-0072021 20060731; KR10-2006-0130210 20061219
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L21/8234 ; H01L29/66

Abstract:
A semiconductor device includes a device isolation structure, a recess channel structure, a first lower gate conductive layer conformal to the recess channel structure and defining a recess, a holding layer over the first lower gate conductive layer to fill the recess defined by the first lower gate conductive layer, and a second lower gate conductive layer over the first lower gate conductive layer and the holding layer. The holding layer is configured to hold a shift of the seam occurring in the recess channel structure.
Public/Granted literature
- US20110121388A1 SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME Public/Granted day:2011-05-26
Information query
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