Invention Grant
- Patent Title: Integrated circuit and seal ring
- Patent Title (中): 集成电路和密封圈
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Application No.: US13615673Application Date: 2012-09-14
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Publication No.: US08933539B2Publication Date: 2015-01-13
- Inventor: Bing-Jye Kuo , Hong-Wen Lin , Yu-Jie Ji
- Applicant: Bing-Jye Kuo , Hong-Wen Lin , Yu-Jie Ji
- Applicant Address: KY Grand Cayman
- Assignee: VIA Telecom Co., Ltd.
- Current Assignee: VIA Telecom Co., Ltd.
- Current Assignee Address: KY Grand Cayman
- Agency: Jianq Chyun IP Office
- Main IPC: H01L23/544
- IPC: H01L23/544
Abstract:
An integrated circuit (IC) and a seal ring thereof are provided. The IC includes a first seal ring. The first seal ring is disposed in the IC. The first seal ring includes at least one stagger structure. The at least one stagger structure includes at least one stagger unit. The at least one stagger unit makes staggered connection with another neighboring stagger unit.
Public/Granted literature
- US20140077341A1 INTEGRATED CIRCUIT AND SEAL RING Public/Granted day:2014-03-20
Information query
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