Invention Grant
- Patent Title: 3D-packages and methods for forming the same
- Patent Title (中): 3D封装及其形成方法
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Application No.: US13789866Application Date: 2013-03-08
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Publication No.: US08933551B2Publication Date: 2015-01-13
- Inventor: Chin-Chuan Chang , Jing-Cheng Lin , Chen-Hua Yu
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L23/02
- IPC: H01L23/02 ; H01L21/00 ; H01L23/495 ; H01L25/065 ; H01L23/00 ; H01L23/48 ; H01L23/538 ; H01L23/498 ; H01L21/56 ; H01L21/78 ; H01L23/14 ; H01L23/31
Abstract:
A package includes an interposer, which includes a first substrate free from through-vias therein, redistribution lines over the first substrate, and a first plurality of connectors over and electrically coupled to the redistribution lines. A first die is over and bonded to the first plurality of connectors. The first die includes a second substrate, and through-vias in the second substrate. A second die is over and bonded to the plurality of connectors. The first die and the second die are electrically coupled to each other through the redistribution lines. A second plurality of connectors is over the first die and the second die. The second plurality of connectors is electrically coupled to the first plurality of connectors through the through-vias in the second substrate.
Public/Granted literature
- US20140252579A1 3D-Packages and Methods for Forming the Same Public/Granted day:2014-09-11
Information query
IPC分类:
