In one embodiment, a semiconductor package comprising a metal base coupled to one or more pins, a semiconductor body having a top side and a bottom side, the top side comprising an integrated circuit and one or more metal surfaces for coupling the integrated circuit to the one more pins with one or more bonding wires, the bottom side non-positively coupled to the metal base, a disk having a top area and a base area, the base area coupled to the top side of the semiconductor body and at least partially covering the integrated circuit, the disk being electrically insulated from the semiconductor body, and a plastic compound completely enclosing the one or more bonding wires, and at least partially enclosing the top side of the integrated circuit, the top area of the disk, and the one or more pins.