Invention Grant
- Patent Title: Wiring board
- Patent Title (中): 接线板
-
Application No.: US12895126Application Date: 2010-09-30
-
Publication No.: US08933556B2Publication Date: 2015-01-13
- Inventor: Nobuyuki Naganuma , Michimasa Takahashi , Masakazu Aoyama
- Applicant: Nobuyuki Naganuma , Michimasa Takahashi , Masakazu Aoyama
- Applicant Address: JP Ogaki-shi
- Assignee: Ibiden Co., Ltd.
- Current Assignee: Ibiden Co., Ltd.
- Current Assignee Address: JP Ogaki-shi
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Main IPC: H01L23/053
- IPC: H01L23/053 ; H01L23/12 ; H05K1/11 ; H05K3/46 ; H05K3/40

Abstract:
A wiring board includes a laminated body having first and second surfaces and including first, second and third insulation layers in the order of the first, second and third insulation layers from the first surface toward the second surface. The first insulation layer has a first hole which penetrates through the first insulation layer and includes a first conductor made of a plating in the first hole. The second insulation layer has a second hole which penetrates through the second insulation layer and includes a second conductor made of a conductive paste in the second hole. The third insulation layer has a third hole which penetrates through the third insulation layer and includes a third conductor made of a plating in the third hole. The first, second and third conductors are positioned along the same axis and are electrically continuous with each other.
Public/Granted literature
- US20110180908A1 WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2011-07-28
Information query
IPC分类: