中科微点-全球专利检索

  1. Login
  2. Sign Up
Invention Grant
US08933557B2 Semiconductor module and cooling unit 有权
半导体模块和冷却单元

Semiconductor module and cooling unit
Abstract:
A semiconductor module including a cooling unit by which a fine cooling effect is obtained is provided. A plurality of cooling flow paths (21c) which communicate with both of a refrigerant introduction flow path which extends from a refrigerant introduction inlet and a refrigerant discharge flow path which extends to a refrigerant discharge outlet are arranged in parallel with one another in a cooling unit (20). Fins (22) are arranged in each cooling flow path (21c). Semiconductor elements (32) and (33) are arranged over the cooling unit (20) so that the semiconductor elements (32) and (33) are thermally connected to the fins (22). By doing so, a semiconductor module (10) is formed. Heat generated by the semiconductor elements (32) and (33) is conducted to the fins (22) arranged in each cooling flow path (21c) and is removed by a refrigerant which flows along each cooling flow path (21c).
Abstract(Chinese):

提供一种半导体模块，其包括获得精细冷却效果的冷却单元。 与从制冷剂导入口延伸的制冷剂导入流路和延伸到制冷剂排出口的制冷剂排出流路连通的多个冷却流路（21c）在冷却单元中彼此平行地配置 （20）。 翅片（22）布置在每个冷却流路（21c）中。 半导体元件（32）和（33）布置在冷却单元（20）上方，使得半导体元件（32）和（33）热连接到翅片（22）。 通过这样做，形成半导体模块（10）。 由半导体元件（32）和（33）产生的热量被传导到布置在每个冷却流路（21c）中的翅片（22），并且通过沿着每个冷却流路（21c）流动的制冷剂去除。

Public/Granted literature
Information query
Espacenet
Patent Agency Ranking
0/0