Invention Grant
- Patent Title: Carbon nanotube structures for enhancement of thermal dissipation from semiconductor modules
- Patent Title (中): 碳纳米管结构，用于增强半导体模块的散热
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Application No.: US13418454Application Date: 2012-03-13
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Publication No.: US08933559B2Publication Date: 2015-01-13
- Inventor: Veeraraghavan S. Basker , Toshiharu Furukawa , Mark C. Hakey , Steven J. Holmes , Charles W. Koburger, III , Krishna V. Singh
- Applicant: Veeraraghavan S. Basker , Toshiharu Furukawa , Mark C. Hakey , Steven J. Holmes , Charles W. Koburger, III , Krishna V. Singh
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Gibb & Riley, LLC
- Main IPC: H01L23/34
- IPC: H01L23/34 ; H01L23/373 ; B82Y10/00 ; B82Y40/00 ; H01L21/683 ; H01L23/31 ; H01L23/433 ; H01L23/00 ; H01L29/06
Abstract:
Disclosed are embodiments of an improved semiconductor wafer structure having protected clusters of carbon nanotubes (CNTs) on the back surface and a method of forming the improved semiconductor wafer structure. Also disclosed are embodiments of a semiconductor module with exposed CNTs on the back surface for providing enhanced thermal dissipation in conjunction with a heat sink and a method of forming the semiconductor module using the disclosed semiconductor wafer structure.
Public/Granted literature
- US20120168931A1 CARBON NANOTUBE STRUCTURES FOR ENHANCEMENT OF THERMAL DISSIPATION FROM SEMICONDUCTOR MODULES Public/Granted day:2012-07-05
Information query
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