Invention Grant
US08933567B2 Electrically broken, but mechanically continuous die seal for integrated circuits
有权
用于集成电路的电破碎但机械连续的模具密封
- Patent Title: Electrically broken, but mechanically continuous die seal for integrated circuits
- Patent Title (中): 用于集成电路的电破碎但机械连续的模具密封
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Application No.: US12784706Application Date: 2010-05-21
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Publication No.: US08933567B2Publication Date: 2015-01-13
- Inventor: David Bang , Thomas Andrew Myers
- Applicant: David Bang , Thomas Andrew Myers
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agent Michelle Gallardo; Nicholas J. Pauley; Jonathan T. Velasco
- Main IPC: H01L23/58
- IPC: H01L23/58
Abstract:
A semiconductor die has multiple discontinuous conductive segments arranged around a periphery of the semiconductor die, and an electrically insulating barrier within discontinuities between the conductive segments. The conductive segments and the barriers form a mechanically continuous seal ring around the semiconductor die.
Public/Granted literature
- US20110284994A1 Electrically Broken, but Mechanically Continuous Die Seal for Integrated Circuits Public/Granted day:2011-11-24
Information query
IPC分类:
