Invention Grant
- Patent Title: Signal distribution structure and method for distributing a signal
- Patent Title (中): 信号分配结构和信号分配方法
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Application No.: US13120157Application Date: 2008-09-19
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Publication No.: US08933718B2Publication Date: 2015-01-13
- Inventor: Bernd Laquai
- Applicant: Bernd Laquai
- Applicant Address: SG Singapore
- Assignee: Advantest (Singapore) Pte Ltd
- Current Assignee: Advantest (Singapore) Pte Ltd
- Current Assignee Address: SG Singapore
- International Application: PCT/EP2008/007913 WO 20080919
- International Announcement: WO2010/031418 WO 20100325
- Main IPC: G01R31/02
- IPC: G01R31/02 ; G01R31/08 ; H01P5/12 ; H01P5/02 ; G01R27/02

Abstract:
A signal distribution structure for distributing a signal to a plurality of devices includes a first signal guiding structure including a first characteristic impedance. The signal distribution structure also includes a node, wherein the first signal guiding structure is coupled to the node. The signal distribution structure includes a second signal guiding structure including one or more transmission lines. The one or more transmission lines of the second signal guiding structure are coupled between the node and a plurality of device connections. The second signal guiding structure includes, side-viewed from the node, a second characteristic impedance which is lower than the first characteristic impedance. The signal guiding structure also includes a matching element connected to the node.
Public/Granted literature
- US20110187399A1 SIGNAL DISTRIBUTION STRUCTURE AND METHOD FOR DISTRIBUTING A SIGNAL Public/Granted day:2011-08-04
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