Invention Grant
- Patent Title: Three-dimensional microstructures having a re-entrant shape aperture and methods of formation
- Patent Title (中): 三维微结构具有重新形成的孔径和形成方法
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Application No.: US13219736Application Date: 2011-08-29
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Publication No.: US08933769B2Publication Date: 2015-01-13
- Inventor: William D. Houck , David W. Sherrer
- Applicant: William D. Houck , David W. Sherrer
- Applicant Address: US VA Radford
- Assignee: Nuvotronics, LLC
- Current Assignee: Nuvotronics, LLC
- Current Assignee Address: US VA Radford
- Agency: Dann Dorfman Herrell & Skillman, PC
- Agent Niels Haun
- Main IPC: H01P3/06
- IPC: H01P3/06 ; H01P11/00 ; B81B3/00
Abstract:
Provided are three-dimensional microstructures and their methods of formation. The microstructures are formed by a sequential build process and include microstructural elements which are affixed to one another. The microstructures find use, for example, in coaxial transmission lines for electromagnetic energy.
Public/Granted literature
- US20120189863A1 THREE-DEIMENSIONAL MICROSTRUCUTRES AND METHODS OF FORMATION THEREOF Public/Granted day:2012-07-26
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