Invention Grant
- Patent Title: Heat conveying structure for electronic device
- Patent Title (中): 电子设备传热结构
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Application No.: US13498102Application Date: 2010-08-12
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Publication No.: US08934245B2Publication Date: 2015-01-13
- Inventor: Minoru Yoshikawa
- Applicant: Minoru Yoshikawa
- Applicant Address: JP Tokyo
- Assignee: NEC Corporation
- Current Assignee: NEC Corporation
- Current Assignee Address: JP Tokyo
- Agency: McGinn IP Law Group, PLLC
- Priority: JP2009-224082 20090929
- International Application: PCT/JP2010/063694 WO 20100812
- International Announcement: WO2011/040129 WO 20110407
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H01L23/427 ; H01L23/24 ; H01L23/473

Abstract:
A heat conveying structure for an electronic device according to the present invention includes: an evaporating section that has a chamber structure with first fins erected therein, is thermally connected to the electronic device, evaporates a liquid coolant on the surfaces of the first fins to thereby change the liquid coolant to a vapor coolant, and sends out liquid coolant present near the first fins along with the vapor coolant as a gas-liquid two-phase flow coolant; a condensing section that has a chamber structure with second fins erected therein, is thermally connected to a radiator provided outside the electronic device, and changes the gas-liquid two-phase flow coolant in contact with the second fins to a liquid coolant; a vapor pipe that connects the evaporating section and the condensing section, and moves the gas-liquid two-phase flow coolant sent out from the evaporating section to the condensing section; and a liquid pipe that connects the evaporating section and the condensing section, and moves the liquid coolant from the condensing section to the evaporating section.
Public/Granted literature
- US20120180993A1 HEAT CONVEYING STRUCTURE FOR ELECTRONIC DEVICE Public/Granted day:2012-07-19
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