Invention Grant
- Patent Title: Electronic device with heat dissipation assembly
- Patent Title (中): 具有散热组件的电子设备
-
Application No.: US13610891Application Date: 2012-09-12
-
Publication No.: US08934249B2Publication Date: 2015-01-13
- Inventor: Tsung-Ming Chen , Yao-Ting Chang
- Applicant: Tsung-Ming Chen , Yao-Ting Chang
- Applicant Address: TW New Taipei
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW New Taipei
- Agency: Novak Druce Connolly Bove + Quigg LLP
- Priority: TW101131443 20120830
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H01L23/34

Abstract:
An electronic device includes a sidewall, a circuit board arranged on the sidewall, an electronic component set on a side of the circuit board opposite to the sidewall, and a heat dissipation assembly connected between the sidewall and the circuit board.
Public/Granted literature
- US20140063746A1 ELECTRONIC DEVICE WITH HEAT DISSIPATION ASSEMBLY Public/Granted day:2014-03-06
Information query