Invention Grant
- Patent Title: Wiring board and method for manufacturing the same
- Patent Title (中): 接线板及其制造方法
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Application No.: US13239707Application Date: 2011-09-22
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Publication No.: US08934262B2Publication Date: 2015-01-13
- Inventor: Masakazu Aoyama , Hidetoshi Noguchi
- Applicant: Masakazu Aoyama , Hidetoshi Noguchi
- Applicant Address: JP Ogaki-shi
- Assignee: Ibiden Co., Ltd.
- Current Assignee: Ibiden Co., Ltd.
- Current Assignee Address: JP Ogaki-shi
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K3/46 ; H05K1/14 ; H05K1/03 ; H05K1/18

Abstract:
A wiring board including a first rigid wiring board having an accommodation portion and a conductor, a second rigid wiring board accommodated in the accommodation portion of the first rigid wiring board and having a conductor electrically connected to the conductor of the first rigid wiring board, and an insulation layer formed on the first rigid wiring board and the second rigid wiring board. The accommodation portion of the first rigid wiring board has wall surfaces tapering from a first surface of the first rigid wiring board to a second surface on the opposite side of the first surface, and the second rigid wiring board has side surfaces tapering such that the side surfaces of the second rigid wiring board substantially fit into the wall surfaces of the accommodation portion of the first rigid wiring board.
Public/Granted literature
- US20120008296A1 WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2012-01-12
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