Invention Grant
US08935644B2 Printed substrate design system, and printed substrate design method
有权
印刷基板设计系统和印刷基板设计方法
- Patent Title: Printed substrate design system, and printed substrate design method
- Patent Title (中): 印刷基板设计系统和印刷基板设计方法
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Application No.: US14234550Application Date: 2012-07-27
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Publication No.: US08935644B2Publication Date: 2015-01-13
- Inventor: Masashi Ogawa , Ken Morishita
- Applicant: Masashi Ogawa , Ken Morishita
- Applicant Address: JP
- Assignee: NEC Corporation
- Current Assignee: NEC Corporation
- Current Assignee Address: JP
- Agency: Wilmer Cutler Pickering Hale and Dorr LLP
- Priority: JP2011-166250 20110729
- International Application: PCT/JP2012/069228 WO 20120727
- International Announcement: WO2013/018725 WO 20130207
- Main IPC: G06F9/455
- IPC: G06F9/455 ; G06F17/50 ; H05K3/00 ; H05K1/02

Abstract:
A printed substrate design system includes: an EMI condition determination unit that compares an EMI characteristic derived by an EMI characteristic derivation unit with an EMI allowable condition, and determines whether the EMI characteristic of a printed substrate satisfies the EMI allowable condition; a substrate configuration change unit that changes an internal configuration of the printed substrate to obtain a changed configuration of the printed substrate in a case where the EMI condition determination unit has determined that the EMI allowable condition is not satisfied, and sets design information of the changed configuration of the printed substrate to design information for deriving the EMI characteristic in the EMI characteristic derivation unit; and an output unit that outputs a printed substrate configuration in a case where the EMI condition determination unit has determined the EMI allowable condition is satisfied.
Public/Granted literature
- US20140181770A1 PRINTED SUBSTRATE DESIGN SYSTEM, AND PRINTED SUBSTRATE DESIGN METHOD Public/Granted day:2014-06-26
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