Invention Grant
- Patent Title: Robotic device for substrate transfer applications
- Patent Title (中): 用于衬底转移应用的机器人装置
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Application No.: US13333688Application Date: 2011-12-21
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Publication No.: US08936293B2Publication Date: 2015-01-20
- Inventor: Christopher O. Lada , Stuart Stephen Papworth Parkin , Mahesh Govind Samant
- Applicant: Christopher O. Lada , Stuart Stephen Papworth Parkin , Mahesh Govind Samant
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Daniel E. Johnson
- Main IPC: B66F19/00
- IPC: B66F19/00

Abstract:
A device for use in the semiconductor industry includes a robotic arm whose end effector includes electromagnetic means to hold a substrate carrier. A pushing member can move independently of a flat, spatula-like portion of the device and is configured to exert force against the substrate carrier while the spatula-like portion is retracted from the substrate carrier, after the substrate carrier has been brought to its intended position. In this manner, the position of the substrate carrier is maintained at its intended position as the spatula-like portion is retracted.
Public/Granted literature
- US20130164113A1 ROBOTIC DEVICE FOR SUBSTRATE TRANSFER APPLICATIONS Public/Granted day:2013-06-27
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