Invention Grant
US08936371B2 Wafer level lens, production method of wafer level lens, and imaging unit
有权
晶圆级透镜,晶圆级透镜的生产方法和成像单元
- Patent Title: Wafer level lens, production method of wafer level lens, and imaging unit
- Patent Title (中): 晶圆级透镜,晶圆级透镜的生产方法和成像单元
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Application No.: US14279524Application Date: 2014-05-16
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Publication No.: US08936371B2Publication Date: 2015-01-20
- Inventor: Yoichi Maruyama
- Applicant: FUJIFILM Corporation
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2009-187858 20090813; JP2009-208365 20090909; JP2009-208366 20090909; JP2009-208367 20090909; JP2010-180625 20100811; JP2010-180626 20100811; JP2010-180627 20100811; JP2010-180628 20100811
- Main IPC: G02B27/00
- IPC: G02B27/00 ; G02B1/11 ; G02B3/00 ; G02B7/02 ; B29D11/00 ; G02B13/00 ; H01L27/146

Abstract:
A sufficient light-shielding property is obtained by a wafer level lens having at least one lens module having a substrate and a plurality of lenses formed on the substrate in which the wafer level lens has a black resist layer formed on the surface of the lens module or on the surface of the substrate and the black resist layer is formed with a pattern having an opening at a part intersecting the optical axis of the lens, and generation of defects such as ghosts, flares and the like due to a reflected light can be prevented and an increase in the production cost can be suppressed.
Public/Granted literature
- US20140246566A1 WAFER LEVEL LENS, PRODUCTION METHOD OF WAFER LEVEL LENS, AND IMAGING UNIT Public/Granted day:2014-09-04
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