Invention Grant
- Patent Title: Multiply thin paper sheet having press-to-bond structure
- Patent Title (中): 具有压接结构的多层薄纸
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Application No.: US12461214Application Date: 2009-08-05
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Publication No.: US08936845B2Publication Date: 2015-01-20
- Inventor: Tung-I Tsai
- Applicant: Tung-I Tsai
- Applicant Address: TW Taoyuan
- Assignee: Chan Li Machinery Co., Ltd.
- Current Assignee: Chan Li Machinery Co., Ltd.
- Current Assignee Address: TW Taoyuan
- Agency: Rosenberg, Klein & Lee
- Priority: TW98108171A 20090313
- Main IPC: B32B3/00
- IPC: B32B3/00 ; D21H27/40 ; B32B29/06 ; D21H27/30

Abstract:
A multiply thin paper sheet having a press-to-bond structure is disclosed, including a first thin paper layer having a first stacking surface and at least one second thin paper layer having a second stacking surface. The first and second stacking surfaces are partially overlapped with each other to define a stacking zone provided between the first thin paper layer and the second thin paper layer. After the stacking zone is subjected to a rolling operation by a rolling pressure, a plurality of first pressed sections are formed on the first thin paper layer, having a predetermined height extended according to a given direction, and a plurality of second pressed sections are formed on the second thin paper layer according to the given direction and respectively corresponding to the first pressed sections of the first thin paper layer. At least one portion of each first pressed section and the respective corresponding second pressed section are bonded and formed as a pressed and bonded site, such that the first thin paper layer and second thin paper layer can be pressed, bonded and patterned simultaneously.
Public/Granted literature
- US20100233440A1 Multiply thin paper sheet having press-to-bond structure Public/Granted day:2010-09-16
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