Invention Grant
- Patent Title: Light emitting diode thermally enhanced cavity package and method of manufacture
- Patent Title (中): 发光二极管热增强腔封装及其制造方法
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Application No.: US14095017Application Date: 2013-12-03
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Publication No.: US08936953B2Publication Date: 2015-01-20
- Inventor: Jonathon G. Greenwood
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Perkins Coie LLP
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L33/60 ; H01L33/64 ; H01L25/16 ; H01L33/48
Abstract:
Several embodiments of light emitting diode packaging configurations including a substrate with a cavity are disclosed herein. In one embodiment, a cavity is formed on a substrate to contain an LED and phosphor layer. The substrate has a channel separating the substrate into a first portion containing the cavity and a second portion. A filler of encapsulant material or other electrically insulating material is molded in the channel. The first portion can serve as a cathode for the LED and the second portion can serve as the anode.
Public/Granted literature
- US20140093989A1 LIGHT EMITTING DIODE THERMALLY ENHANCED CAVITY PACKAGE AND METHOD OF MANUFACTURE Public/Granted day:2014-04-03
Information query
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